发明名称 |
Drawn dummy FeCAP, via and metal structures |
摘要 |
An integrated circuit containing hydrogen permeable dummy vias configured in a linear or rectangular array and symmetrically positioned over a component in the integrated circuit. An integrated circuit containing matching components with identical layouts and hydrogen permeable dummy vias in identical configurations over the matching components. A process of forming an integrated circuit containing matching components with identical layouts and hydrogen permeable dummy vias in identical configurations over the matching components. |
申请公布号 |
US9536822(B2) |
申请公布日期 |
2017.01.03 |
申请号 |
US200912576340 |
申请日期 |
2009.10.09 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Summerfelt Scott R.;Aggarwal Rajni J. |
分类号 |
H01L21/02;H01L21/00;H01L23/522;H01L23/58;H01L27/02;H01L49/02;H01L27/115 |
主分类号 |
H01L21/02 |
代理机构 |
|
代理人 |
Keagy Rose Alyssa;Brill Charles A.;Cimino Frank D. |
主权项 |
1. An integrated circuit, comprising:
a substrate; a component located on said substrate; a dielectric layer located on said substrate and above said component; a plurality of electrically active ferroelectric structures located over said dielectric layer; a hydrogen barrier located above said electrically active ferroelectric structures; an inter-level dielectric layer located on said hydrogen barrier; a plurality of electrically active vias located in said inter-level dielectric layer and said hydrogen barrier; and a plurality of hydrogen permeable dummy vias configured in one of a linear array or a rectangular array, said plurality of hydrogen permeable dummy vias symmetrically positioned over said component and located in said inter-level dielectric layer and said hydrogen barrier such that at least a portion of bottom surfaces of said plurality of hydrogen permeable dummy vias contact said dielectric layer. |
地址 |
Dallas TX US |