Semiconductor laser assembly and packaging system

摘要

A system for self-aligning assembly and packaging of semiconductor lasers allows reduction of time, cost and testing expenses for high power density systems. A laser package mounting system, such as a modified TO-can (transistor outline can), has modifications that increase heat transfer from the active laser to a heat exchanger or other heat sink. A prefabricated heat exchanger assembly mounts both a laser package and one or more lenses. Direct mounting of a fan assembly to the package further minimizes assembly steps. Components may be physically and optically aligned during assembly by clocking and other indexing means, so that the entire system is self-aligned and focused by the assembly process without requiring post-assembly adjustment. This system can lower costs and thereby enable the use of high powered semiconductor lasers in low cost, high volume production, such as consumer items.

主权项

1. A method for assembling high powered semiconductor laser systems to provide lasers which are passively or self-aligned and have predefined focal points or imaging planes without post-fabrication adjustment, wherein the method comprises:
affixing a semiconductor laser chip to a carrier; said carrier having power connections, a base, and a heat spreading mount that projects from the base; placing said carrier into a heat-exchanging relationship with a heat exchanger by inserting the carrier, which includes the semiconductor laser chip, into a bore in the heat exchanger, the bore having a larger diameter section and a smaller diameter section that receives the heat spreading mount, whereby said heat exchanger and said carrier are passively or self aligned into an efficient heat exchanging contact; affixing an optical element to one or both of said heat exchanger for said lasers, and said carrier, wherein said laser systems produced by said method have at least one output laser beam from each semiconductor laser chip, each beam having a predefined direction of propagation without post-fabrication adjustment; and inserting the heat exchanger into a housing that surrounds the heat exchanger, wherein the housing includes vents to allow the passage of air over the heat-exchanger and through the housing.