发明名称 |
Magnetic field probe |
摘要 |
A detector of a magnetic field probe includes a first wiring pattern formed on a first surface of a multilayer substrate and having a predetermined inclination with respect to an axial line direction of the magnetic field probe, a second wiring pattern formed on a second surface and having the predetermined inclination with respect to the axial line direction, and a first penetrating via penetrating through the multilayer substrate in the thickness direction and connecting a front end portion of the first wiring pattern and a front end portion of the second wiring pattern. A rear end portion of the first wiring pattern is connected to a conductor pattern configuring a strip line and a rear end portion of the second wiring pattern is connected to ground patterns configuring the strip line. |
申请公布号 |
US9535136(B2) |
申请公布日期 |
2017.01.03 |
申请号 |
US201414498783 |
申请日期 |
2014.09.26 |
申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Shimizu Noriko;Ichimura Takashi;Azuma Takahiro |
分类号 |
G01R33/02;G01R33/00;G01R29/08 |
主分类号 |
G01R33/02 |
代理机构 |
Studebaker & Brackett PC |
代理人 |
Studebaker & Brackett PC |
主权项 |
1. A magnetic field probe comprising:
a wiring substrate; a detector formed on a front end portion of the wiring substrate; and a transmission line having a conductor pattern and a ground pattern and connecting the detector and a base end portion of the wiring substrate, wherein the detector includes:
a first line wiring pattern formed on a first surface of the wiring substrate and having a predetermined inclination with respect to an axial direction of the magnetic field probe;a second line wiring pattern formed on a second surface of the wiring substrate, which opposes the first surface, and having the predetermined inclination with respect to the axial direction of the magnetic field probe; anda first via penetrating through the wiring substrate in a thickness direction and connecting a front end portion of the first line wiring pattern and a front end portion of the second line wiring pattern, a rear end portion of the first line wiring pattern being connected to the conductor pattern configuring the transmission line, and a rear end portion of the second line wiring pattern being connected to the ground pattern configuring the transmission line. |
地址 |
Kyoto-Fu JP |