| 发明名称 | Chip card substrate and method of forming a chip card substrate | ||
| 摘要 | A chip card substrate is provided that includes a first polymer layer including a first polymer material. The chip card substrate further includes an intermediate layer disposed over the first polymer layer and including polyolefin including a plurality of micro pores, an adhesive layer disposed over the intermediate layer and including an adhesive, and a second polymer layer disposed over the adhesive layer and including a second polymer material different from the first polymer material. | ||
| 申请公布号 | US9533473(B2) | 申请公布日期 | 2017.01.03 |
| 申请号 | US201414243970 | 申请日期 | 2014.04.03 |
| 申请人 | Infineon Technologies AG | 发明人 | Hoffner Siegfried;Hussein Mohammed Reza;Pueschner Frank;Spoettl Thomas |
| 分类号 | B32B27/08;B32B27/36;B32B37/24;B32B27/30;B32B27/32;B32B3/26;B32B7/12;B32B37/12;B32B27/20;B32B37/14 | 主分类号 | B32B27/08 |
| 代理机构 | Viering, Jentschura & Partner mbB | 代理人 | Viering, Jentschura & Partner mbB |
| 主权项 | 1. A chip card substrate, comprising: a first polymer layer comprising a first polymer material selected from the group consisting of a polyimide, a polyvinyl chloride, a polycarbonate, and combinations thereof, an intermediate layer disposed over the first polymer layer and comprising polyolefin comprising a plurality of micro pores; an adhesive layer disposed over the intermediate layer and comprising an adhesive; a second polymer layer disposed over the adhesive layer and comprising a second polymer material different from the first polymer material; and wherein the second polymer layer comprises an antenna. | ||
| 地址 | Neubiberg DE | ||