Method for manufacturing multilayer electronic component

摘要

A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

主权项

1. A method for manufacturing a multilayer electronic component, comprising the steps of:
preparing a laminate including a plurality of insulating layers laminated to each other and a plurality of internal electrodes formed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate; and forming an external electrode on the predetermined surface so as to electrically connect the edges of the internal electrodes, which are exposed at the predetermined surface of the laminate; wherein the step of forming an external electrode includes:
a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface of the laminate which is prepared in the step of preparing a laminate and by performing plating growth of the plating deposits so as to be connected to each other; anda heat treatment step of performing a heat treatment on the laminate provided with the plating film formed thereon at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 800° C. or more; and the heat treatment step causes counter diffusion between a metal component in the internal electrodes and a metal component in the plating film, such that a counter diffusion layer is formed at boundary portions between the internal electrodes and the plating film, and the metal component in the plating film and the metal component in the plurality of internal electrodes are both detectable in the counter diffusion layer the counter diffusion layer extends to a location spaced from the predetermined surface of the laminate by about 2 microns or more.