Bonding structure of electronic equipment

摘要

Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

主权项

1. A bonding structure of an electronic equipment, comprising:
first electrodes extending in a first direction and arranged in a second direction, the first electrodes being disposed on a stretchable display panel; second electrodes extending in the first direction and arranged in the second direction, the second electrodes being disposed on a substrate, the second electrodes facing the first electrodes; solder bonding parts interposed between the first electrodes and the second electrodes, the solder bonding parts facing each other in the second direction and arranged to configure a plurality of rows in the first direction; first under bump metallization (UBM) pads disposed between the first electrodes and the solder bonding parts; a first insulating layer disposed on the stretchable display panel, the first insulating layer covering the first electrodes and separating the first UBM pads; second UBM pads disposed between the second electrodes and the solder bonding parts; a second insulating layer disposed on the substrate, the second insulating layer covering the second electrodes and separating the second UBM pads; and an underfill resin layer disposed between the first insulating layer and the second insulating layer.