Wired circuit board and producing method thereof

摘要

A wired circuit board includes a first insulating layer, a first conductive layer provided over the first insulating film and including a first wire, a second insulating layer provided over the first insulating layer so as to cover the first wire, and a second conductive layer provided over the second insulating layer and including a second wire. The second conductive layer includes a first terminal portion for electrically connecting the first wire to an outside, a second terminal portion for electrically connecting the second wire to an outside, and a connection portion electrically connecting the first terminal portion and the first wire.

主权项

1. A wired circuit board, comprising:
a first insulating layer; a first conductive layer including a first wire directly disposed on an upper surface of the first insulating layer; a second insulating layer directly disposed on the upper surface of the first insulating layer so as to cover the first wire; and a second conductive layer including a second wire directly disposed on an upper surface of the second insulating layer, wherein the second conductive layer includes: a first terminal portion for electrically connecting the first wire to an outside; a second terminal portion for electrically connecting the second wire to an outside; and a connection portion electrically connecting the first terminal portion and the first wire, wherein the first terminal portion and the second terminal portion are disposed side by side on the upper surface of the first insulating layer, wherein the second conductive layer further includes a positioning mark for positioning a component to be mounted relative to the wired circuit board, and wherein the positioning mark has a generally annular shape in a plan view.