Passive cooling system integrated into a printed circuit board for cooling electronic components

摘要

A passive cooling system is provided for dissipating heat from an electronic component. The system includes a printed circuit board including a first dielectric layer and a first conductive layer, an electronic component coupled to the printed circuit board via a plurality of electrical contacts, and a cooling component thermally coupled to the electronic component through the first conductive layer by a micro via thermal array.

主权项

1. A system comprising: a printed circuit board including a first dielectric layer and a first conductive layer; an electronic component coupled to the printed circuit board via a plurality of electrical contacts that electronically and thermally couple the electronic component to the first conductive layer; a cooling component coupled to the printed circuit board via a micro via thermal array; wherein the micro via thermal array comprises a two-dimensional array of vias, each via having a diameter equal to or less than one hundred micrometers; and a heat sink in contact with a top surface of the electronic component, wherein the cooling component comprises a dedicated convective or conductive thermal structure that is separate and distinct from the heat sink in contact with the top surface of the electronic component, the cooling component is thermally coupled to the electronic component through the first conductive layer by the micro via thermal array, and the cooling component does not directly contact a surface of the electronic component; wherein the first conductive layer comprises a ground plane of the printed circuit board that is electrically coupled to a reference voltage of a voltage supply.