Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

摘要

A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means of an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

主权项

1. A light emitting device comprising:
a resin package comprising a resin part and a metal part including first and second metal plates, said resin package having four outer lateral surfaces and having a concave portion having a bottom surface; and a light emitting element mounted on the bottom surface of the concave portion and electrically connected to the metal part, wherein at least a portion of an outer lateral surface of the resin part and at least a portion of an outer lateral surface of the metal part are coplanar at each of the four outer lateral surfaces of the resin package, wherein a notch is formed in the metal part at each of the four outer lateral surfaces of the resin package, wherein the resin part is located at left and right sides of a portion of the metal part at at least two of the four outer lateral surfaces of the resin package, and wherein each of the first and second metal plates is substantially flat.