发明名称 |
Vertical type AC-LED device and manufacturing method thereof |
摘要 |
The present invention discloses a vertical AC LED element and fabrication method thereof, wherein the vertical AC LED element comprises a conductive substrate (102); a light-emitting module on the conductive substrate (102), including two horizontally arranged in parallel and mutually-isolated LEDs; wherein the first and second LEDs include a first semiconductor layer (111), a light-emitting layer (112) and a second semiconductor layer (113) from top down; a first insulating layer (131) is arranged between the second semiconductor layer (113) of the first LED and the conductive substrate (102) for mutual isolation; an ohmic contact is formed between the second semiconductor layer (113) of the second LED and the conductive substrate (102); a first conductive structure that connects the first semiconductor layer (111) of the first LED, the second semiconductor layer (113) of the second LED and the conductive substrate (102); and a second conductive structure that connects the second semiconductor layer (113) of the first LED and the first semiconductor layer (111) of the second LED. |
申请公布号 |
US9537048(B2) |
申请公布日期 |
2017.01.03 |
申请号 |
US201314402175 |
申请日期 |
2013.03.21 |
申请人 |
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
Chen Shunping;Zeng Xiaoqiang;Huang Shaohua;Pan Qunfeng;Wu Jyh-Chiarng |
分类号 |
H01L33/08;H01L27/15;H01L25/075;H01L33/00;H01L33/38;H01L33/44;H01L33/62 |
主分类号 |
H01L33/08 |
代理机构 |
Syncoda LLC |
代理人 |
Syncoda LLC ;Ma Feng;Feng Junjie |
主权项 |
1. A vertical alternating current (AC) light-emitting diode (LED) element, comprising:
a conductive substrate; a light-emitting portion disposed over the conductive substrate, the light-emitting portion including a first and a second horizontally arranged in parallel and mutually-isolated LEDs; wherein, the first and second LEDs include a first semiconductor layer, a light-emitting layer and a second semiconductor layer from top down; a first insulating layer is arranged between the second semiconductor layer of the first LED and the conductive substrate for mutual isolation; an ohmic contact is formed between the second semiconductor layer of the second LED and the conductive substrate; a conductive column configured to electrically couple the first semiconductor layer of the first LED, the second semiconductor layer of the second LED, and the conductive substrate; and a shared electrode layer configured to electrically couple the second semiconductor layer of the first LED and the first semiconductor layer of the second LED. |
地址 |
Xiamen CN |