Apparatus and methods for treating a substrate

摘要

A substrate treatment apparatus is provided. The apparatus may include a process chamber configured to have an internal space, a substrate supporting member disposed in the process chamber to support a substrate, a first supplying port configured to supply a supercritical fluid to a region of the internal space located below the substrate, a second supplying port configured to supply a supercritical fluid to other region of the internal space located over the substrate, and an exhaust port configured to exhaust the supercritical fluid from the process chamber to an exterior region.

主权项

1. A substrate treatment apparatus, comprising:
a process chamber having an internal space and at least one inclined inner side surface; a substrate supporting member disposed in the process chamber to support a substrate; a blocking plate disposed in the process chamber below the substrate supporting member, wherein the blocking plate has a bottom surface spaced apart from an internal bottom surface of the process chamber and at least one side surface; a first supplying port formed through a bottom wall of the process chamber and configured to supply a supercritical fluid to a region of the internal space located below the substrate and to supply the supercritical fluid to the bottom surface of the blocking plate; a second supplying port configured to supply a supercritical fluid to a region of the internal space located above the substrate; and an exhaust port configured to exhaust the supercritical fluid from the process chamber to an exterior region, wherein the at least one side surface of the blocking plate is parallel to the at least one inclined inner side surface of the process chamber.