| 发明名称 | Apparatus and method for on line surface enhancement of a workpiece | ||
| 摘要 | An apparatus to cut and surface process a workpiece includes a cutting tool to cut the workpiece; a peening tool to peen surfaces of the cut workpiece; and a controller to control the cutting tool, the peening tool and the workpiece to move simultaneously. | ||
| 申请公布号 | US9533371(B2) | 申请公布日期 | 2017.01.03 |
| 申请号 | US201213351380 | 申请日期 | 2012.01.17 |
| 申请人 | United Technologies Corporation | 发明人 | El-Wardany Tahany Ibrahim;Viens Daniel V.;Grelotti Robert A.;Sangiovanni Joseph J.;Zimmerman John F.;Zhang Yan |
| 分类号 | B23K26/00;B23P23/04;B23P9/04;C21D7/06;C21D9/00;B23K101/00 | 主分类号 | B23K26/00 |
| 代理机构 | Kinney & Lange, P.A. | 代理人 | Kinney & Lange, P.A. |
| 主权项 | 1. A method of surface processing and machining a workpiece with an apparatus comprising a cutting tool, a peening tool and a controller, the method comprising: cutting a first surface of a workpiece with the cutting tool; peening the first surface of the workpiece with the peening tool that focuses a laser beam onto the first surface of the workpiece; and supporting a second surface of the workpiece with the cutting tool without cutting the second surface, wherein the supporting of the second surface of the workpiece is performed while the peening of the first surface of the workpiece is performed by the peening tool. | ||
| 地址 | CT US | ||