发明名称 |
Cu-Ga ALLOY SPUTTERING TARGET AND METHOD FOR PRODUCING SAME |
摘要 |
According to the present invention, a Cu-Ga alloy sputtering target which is a sintered body has a composition with 29.5 atom% to 43.0 atom% of Ga and a balance of Cu and inevitable impurities. A Cu-Ga alloy crystal particle in the sintered body has a structure in which ³ phase particles are dispersed in a ³ 1 -phase crystal particle. A method for producing the sputtering target includes a step of performing normal pressure sintering by heating a molded body formed of a powder mixture of a pure Cu powder and a Cu-Ga alloy powder in a reducing atmosphere, and a step of cooling the obtained sintered body at a cooling rate of 0.1°C/min to 1.0°C/min, at a temperature having a range of 450°C to 650°C. |
申请公布号 |
EP3101153(A1) |
申请公布日期 |
2016.12.07 |
申请号 |
EP20140881074 |
申请日期 |
2014.11.18 |
申请人 |
Mitsubishi Materials Corporation |
发明人 |
YOSHIDA Yuuki;ISHIYAMA Kouichi;MORI Satoru |
分类号 |
C23C14/34;B22F1/00;B22F3/10;C22C1/04;C22C1/05;C22C9/00;H01L31/0749 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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