发明名称 Cu-Ga ALLOY SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
摘要 According to the present invention, a Cu-Ga alloy sputtering target which is a sintered body has a composition with 29.5 atom% to 43.0 atom% of Ga and a balance of Cu and inevitable impurities. A Cu-Ga alloy crystal particle in the sintered body has a structure in which ³ phase particles are dispersed in a ³ 1 -phase crystal particle. A method for producing the sputtering target includes a step of performing normal pressure sintering by heating a molded body formed of a powder mixture of a pure Cu powder and a Cu-Ga alloy powder in a reducing atmosphere, and a step of cooling the obtained sintered body at a cooling rate of 0.1°C/min to 1.0°C/min, at a temperature having a range of 450°C to 650°C.
申请公布号 EP3101153(A1) 申请公布日期 2016.12.07
申请号 EP20140881074 申请日期 2014.11.18
申请人 Mitsubishi Materials Corporation 发明人 YOSHIDA Yuuki;ISHIYAMA Kouichi;MORI Satoru
分类号 C23C14/34;B22F1/00;B22F3/10;C22C1/04;C22C1/05;C22C9/00;H01L31/0749 主分类号 C23C14/34
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