发明名称 発光素子用基板、基板用材料および発光モジュール
摘要 Provided is a substrate for light emitting elements, which is capable of suppressing decrease in the quantity of light of a light emitting module due to decrease in the quantity of reflected light at a light-reflecting layer. This substrate (1) for light emitting elements comprises a base layer (11) that has a bonding region (13) which can be bonded to a light-reflecting layer (12). The light-reflecting layer is compression bonded to the whole or a part of the bonding region of the base layer.
申请公布号 JP6040938(B2) 申请公布日期 2016.12.07
申请号 JP20130518170 申请日期 2012.05.31
申请人 日立金属株式会社 发明人 山本 晋司;織田 喜光;石尾 雅昭
分类号 H01L33/60;H01L33/64 主分类号 H01L33/60
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