LOW PROFILE, HIGHLY CONFIGURABLE, CURRENT SHARING PARALLELED WIDE BAND GAP POWER DEVICE POWER MODULE

摘要

A power module (100) with multiple equalized parallel power paths supporting multiple parallel bare die power devices (500) constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts (400) provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate (600) is provided with individual ballast resistors and simple bolted construction. Gate drive connectors (700) are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.