MICROPHONE ASSEMBLY WITH EMBEDDED ACOUSTIC PORT

摘要

Described are techniques for creating acoustic inlet manifolds for a microphone that utilize existing flex or printed circuit board (PCB) technology to create an ultra-low profile manifold. The described techniques: take advantage of the ability to allow reflow connection. By embedding an acoustic path between the layers or creating an acoustic path on the surface of a flex or PCB assembly, the microphone can be reflowed onto the manifold assembly.