发明名称 HEAT INSULATION DEVICE AND HEAT STORAGE SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a heat insulation device that can secure heat insulation performance with a simple structure even at a low leak rate.SOLUTION: In a heat insulation device 100, a hollow part 39 that is a heat insulation layer is provided with a pressure reducing pipe 32. The pressure reducing pipe 32 is provided with a pressure reducing part 37 for reducing the pressure of the hollow part 39. Therefore, the pressure of the hollow part 39 can be reduced by the pressure reducing part 37. Because the degree of vacuum is made higher by reducing the pressure, heat insulation performance can be improved. The pressure reducing pipe 32 is also provided with a check valve 36 for preventing backflow. Therefore, air can be restrained from flowing backward from the pressure reducing part 37 to the hollow part 39 by the check valve 36 even after the pressure is reduced by the pressure reducing part 37. Thereby, the reduced pressure state achieved by pressure reducing part 37 can be kept.SELECTED DRAWING: Figure 2
申请公布号 JP2016200168(A) 申请公布日期 2016.12.01
申请号 JP20150078671 申请日期 2015.04.07
申请人 DENSO CORP 发明人 OKAMURA TORU;IMAMURA TOMONORI
分类号 F16L59/06;F01N5/02;F01P3/20 主分类号 F16L59/06
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