| 摘要 |
PROBLEM TO BE SOLVED: To provide a component mounting device and a component mounting method capable of mounting a component on an upper layer side base material, without providing a camera for imaging an upper layer side mark from above separately.SOLUTION: A lower layer side mark 2m attached to a lower layer side base material 2a is imaged from below the lower layer side base material 2a, by means of an upper imaging camera 75 disposed while directing the imaging visual field upward (step ST12). Based on the information thus obtained, and the relative positional relationship data, indicating the relative positional relationship of the preset lower layer side mark 2m and an upper layer side mark 2M attached to the upper surface of an upper layer side base material 2b, a mounting component 3B is mounted on the upper layer side base material 2b (step ST15).SELECTED DRAWING: Figure 9 |
