| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip fuse the cutoff performance of which can be improved.SOLUTION: A chip fuse 1 includes a substrate 2. On the substrate 2, a wiring film 45 is formed including a fusible element 7 fused by a predetermined amount of heat. A first external electrode 18 and a second external electrode 19 for connecting the fusible element 7 to the outside are electrically connected to the wiring film 45. On the substrate 2, a resin film 15 is formed so as to cover the wiring film 45. The resin film 15 has an opening 20 for the fusible element at least above the fusible element 7.SELECTED DRAWING: Figure 4 |
