发明名称 POWER MODULE PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
摘要 A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.
申请公布号 US2016352247(A1) 申请公布日期 2016.12.01
申请号 US201615168235 申请日期 2016.05.30
申请人 DELTA ELECTRONICS, INC. 发明人 LI Zeng;LU Jun-Cheng;WANG Tao;WAN Zheng-Fen;ZHAO Zhen-Qing
分类号 H02M7/00;H01L25/18;H01L21/56;H01L21/48;H01L23/00;H01L23/498;H01L25/07 主分类号 H02M7/00
代理机构 代理人
主权项 1. A power module packaging structure comprising: a first conducting layer; a first insulating layer disposed above the first conducting layer; a second conducting layer disposed above the first insulating layer; a first power device disposed on the first conducting layer; and a first controlling device disposed on the second conducting layer and used for controlling the first power device; wherein the first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop, a direction of a current that flows through the first conducting layer in the loop is opposite to a direction of a current that flow through the second conducting layer in the loop.
地址 Taoyuan City TW