| 发明名称 |
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A chip package includes a substrate, a conductive layer and a plurality of thermal dissipation connections. The substrate includes a light-sensing region and has an upper surface and a lower surface opposite to each other. The conductive layer is disposed at the lower surface of the substrate and includes a light-shielding dummy conductive layer substantially aligned with the light-sensing region. The thermal dissipation connections are disposed beneath the lower surface of the substrate. |
| 申请公布号 |
US2016351608(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615163625 |
申请日期 |
2016.05.24 |
| 申请人 |
XINTEC INC. |
发明人 |
HUANG Yu-Lung;LIAO Chi-Chang;LIU Tsang-Yu |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package, comprising:
a substrate comprising a light-sensing region and having an upper surface and a lower surface opposite to each other; a conductive layer disposed at the lower surface of the substrate and comprising a light-shielding dummy conductive layer substantially aligned with the light-sensing region; and a plurality of thermal dissipation connections disposed underneath the lower surface of the substrate. |
| 地址 |
Taoyuan City TW |
