发明名称 ULTRASOUND SENSOR AND METHOD OF MANUFACTURING THEREOF
摘要 An ultrasound sensor, including a plurality of ultrasound elements which include a first electrode, a piezoelectric layer, and a second electrode and which are arranged in a first direction and a second direction, in which at least a portion of the plurality of ultrasound elements are grouped, at least one of the first electrode and the second electrode is shared for each of the grouped ultrasound elements, bypass wiring is connected to at least one of the shared first electrode and second electrode, a following α value of the bypass wiring is greater than the α value of the first electrode or second electrode on which the bypass wiring is connected, and the electric resistance value per unit length of the bypass wiring is lower than that of the first electrode or the second electrode.;α value=(Young's modulus of Constituent Material)×(cross-sectional area of wiring or electrode)
申请公布号 US2016345934(A1) 申请公布日期 2016.12.01
申请号 US201515115146 申请日期 2015.06.30
申请人 Seiko Epson Corporation 发明人 KOJIMA Chikara
分类号 A61B8/00;H01L41/29;H01L41/047;H01L41/113;H04R17/00;H04R31/00 主分类号 A61B8/00
代理机构 代理人
主权项 1. An ultrasound sensor, comprising: a plurality of ultrasound elements which include a first electrode, a piezoelectric layer, and a second electrode and which are arranged in a first direction and a second direction, wherein at least a portion of the plurality of ultrasound elements are grouped, at least one of the first electrode and the second electrode is shared for each of the grouped ultrasound elements, bypass wiring is connected to one of the shared first electrode and second electrode, an α value of the bypass wiring is greater than the α value of the first electrode or second electrode to which the bypass wiring is connected, and when electric resistance values per unit length are compared, the electric resistance value of the bypass wiring is lower than the electrical resistance value of the first electrode or the second electrode to which the bypass wiring is connected. α value=(Young's modulus of Constituent Material)×(cross-sectional area of wiring or electrode)
地址 Tokyo JP