NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM OBTAINED BY CURING SAME, METHOD FOR PRODUCING CURED FILM, OPTICAL DEVICE PROVIDED WITH CURED FILM, AND BACKSIDE-ILLUMINATED CMOS IMAGE SENSOR

摘要

The present invention has been completed to develop a negative photosensitive resin composition that exhibits high refractive index, high transparency properties with no additional post-exposure process, high sensitivity in the exposure, and high resolution and solvent resistance after the pattern formation, and which is capable of providing a pattern having a rectangular cross section adapted for pixel formation and partition formation. Such object is achieved by a negative photosensitive resin composition comprising the following (a) to (d):
(a) metallic compound particles,
(b) a polysiloxane compound,
(c) a compound having at least 1 group containing an ±,²-unsaturated carboxylate ester structure, and
(d) a photopolymerization initiator, the composition further comprising
(e) a compound containing maleimide group.