发明名称 |
HYBRID CHIP-ON-BOARD LED MODULE WITH PATTERNED ENCAPSULATION |
摘要 |
Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, second light emitting elements (170) of a particular color are encapsulated with a transparent second encapsulant (120;420;520), while first light emitting elements (160) of a different color are encapsulated with a wavelength conversion first encapsulant (110;410;510). In another embodiment of this invention, a particular second set of second and third light emitting elements (170,580) of different colors is encapsulated with a different encapsulant than another first set of first light emitting elements (160). |
申请公布号 |
EP3097588(A1) |
申请公布日期 |
2016.11.30 |
申请号 |
EP20140786289 |
申请日期 |
2014.08.26 |
申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
SOER, WOUTER ANTHON;HELBING, RENE;HUANG, GUAN |
分类号 |
H01L25/075;H01L33/50;H01L33/52;H01L33/54 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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