发明名称 基板折割装置及び基板折割方法
摘要 PROBLEM TO BE SOLVED: To improve quality of the split section of a substrate W by applying bending moment of an optimal size and tensile stress to the broken and split part Wa of the substrate W according to characteristics of the substrate W.SOLUTION: Immediately before or at the moment when a break bar 59 is brought into contact with a broken and split part Wa of a substrate W, the moving direction of a breaking and splitting head 49 is changed from a vertical lower direction to an oblique lower direction for separation from a table 3, and the breaking and splitting head 49 is moved obliquely downward by driving of a lifting power servo cylinder 43 and a horizontal movement power servo cylinder 53 to apply bending moment and tensile stress to the broken and split part Wa of the substrate W.
申请公布号 JP6035929(B2) 申请公布日期 2016.11.30
申请号 JP20120156214 申请日期 2012.07.12
申请人 株式会社IHI 发明人 久住 智勇
分类号 B26F3/00;B28D5/00;C03B33/033 主分类号 B26F3/00
代理机构 代理人
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