发明名称 プリモールドリードフレームの製造方法、および、半導体装置の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a high-quality lead frame by reducing failure occurring in gate break after resin molding.SOLUTION: A lead frame which is filled with a resin with being clamped by a mold comprises: blank parts to be filled with the resin; a first half-etching part provided at a position corresponding to a gate of the mold for injecting the resin into the blank parts; and a second half-etching part provided at a position corresponding to an air vent of the mold for exhausting air from the blank parts when the resin is injected into the blank parts.
申请公布号 JP6034078(B2) 申请公布日期 2016.11.30
申请号 JP20120154442 申请日期 2012.07.10
申请人 アピックヤマダ株式会社 发明人 前川 昌範;成田 和夫
分类号 H01L23/50;H01L21/56 主分类号 H01L23/50
代理机构 代理人
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