| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation efficiency and manufacturing efficiency of an electronic apparatus and reduce the manufacturing costs.SOLUTION: An electronic apparatus 1 includes: a heat sink 2; a substrate 3 disposed on an arrangement surface 11a of the heat sink 2; a cylindrical frame body 4 which is disposed on the arrangement surface 11a so as to enclose the substrate 3; a sealing resin 5 which fills the interior of the frame body 4 and seals the substrate 3; and fixing means which fixes the frame body 4 by pressing an axial first end part 4A of the frame body 4 against the arrangement surface 11a. In the electronic apparatus 1, an elastically deformable heat radiation sheet 8 is disposed between the arrangement surface 11a and the substrate 3 and between the arrangement surface 11a and the first end part 4A of the frame body 4. |
