发明名称 熱交換器
摘要 A heat exchanger 100 disclosed is a heat exchanger that exchanges heat between a first fluid and a second fluid. The heat exchanger 100 includes: a resin structure 10 forming a first flow path through which the first fluid flows; and a copper pipe 20 forming a second flow path through which the second fluid flows, the copper pipe 20 having at least a portion disposed in the first flow path. A resin component of a resin composition constituting the resin structure 10 contains, as a main component, a polymer alloy of a polyphenylene ether resin and a polystyrene resin. A mass ratio of the polyphenylene ether resin to the polystyrene resin in the polymer alloy is in the range of 40/60 to 65/35.
申请公布号 JP6032573(B2) 申请公布日期 2016.11.30
申请号 JP20140524639 申请日期 2013.07.04
申请人 パナソニックIPマネジメント株式会社 发明人 鈴木 基啓;森本 暁;保手浜 健一
分类号 F28F21/06;C08L25/06;C08L71/12;F28D7/10 主分类号 F28F21/06
代理机构 代理人
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