发明名称 ピールプライ、このピールプライを用いてコンポジット構造を表面調製し、結合する方法
摘要 A resin-rich peel ply (11) that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates (10) The resin-rich peel ply (11) is composed of a woven fabric (lib) impregnated with a resin matrix (11a) different from the resin matrix of the composite substrate (10). The peel ply (11) is designed such that, upon manual removal of the peel ply (11) from the composite substrate's (10) surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate (12), but no fibrous material from the woven fabric remains on the same surface.
申请公布号 JP6033328(B2) 申请公布日期 2016.11.30
申请号 JP20140550296 申请日期 2012.11.16
申请人 サイテク・テクノロジー・コーポレーシヨン 发明人 チヤオ,イーチヤン;コーリ,ダリプ・クマー;シヤー,クナル・ガウラング
分类号 B32B5/28;B29C65/50;C08J5/04 主分类号 B32B5/28
代理机构 代理人
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