| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure sensor in which the occurrence of cracks in bonding glass and a sensor chip and the destruction of the bonding glass and the sensor chip can be suppressed.SOLUTION: The pressure sensor includes a metallic stem 10 having a diaphragm 11 for pressure detection, bonding glass 50 provided on the diaphragm 11, and a sensor chip 40 which is bonded to the diaphragm 11 via the bonding glass 50 and outputs a sensor signal corresponding to distortion of the diaphragm 11. When the sensor chip 40 has a thickness of 50 μm or larger, the pressure sensor satisfies 1≤T/R where T [μm] is the thickness of the bonding glass 50 and R [μm] is the maximum diameter of voids 51 existing in the bonding glass 50. |
