| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for segmenting a substrate surely by laser without generating segmentation failure, by a simple process.SOLUTION: A method for forming a plurality of grooves on a brittle material substrate surface by radiating laser light along crossing first and second processing projected lines on the brittle material substrate surface includes a first step and a second step. In the first step, a groove in a first direction is formed on the brittle material substrate by radiating pulse laser light along the first processing projected line. In the second step, a groove in a second direction of the brittle material substrate is formed by radiating pulse laser light along the second processing projected line, and by stopping radiation of the pulse laser light at a part crossing the groove in the first direction. |
