| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board and a method of manufacturing a printed wiring board, capable of suppressing occurrence of burrs at a cut surface and deformation of a printed wiring board when processing a profile of the printed wiring board.SOLUTION: A printed wiring board 100 includes a resin composition layer 102, a first metal layer 106 which is provided on one surface 104 of the resin composition layer 102, with a circuit formed on it, a second metal layer 110 provided on the other surface 108 of the resin composition layer 102. When observed from the other surface 108, the printed wiring board includes a first region 118 in which the resin composition layer 102 is scheduled to be cut, and a second region which is present in the first region 118, with the thickness of the second metal layer 110 being 1 μm or less. The percentage of the area of the second region occupied in the area of the first region 118 is 90% or more. |
