A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi (0,689476 MPa).
申请公布号
EP2573805(B1)
申请公布日期
2016.11.30
申请号
EP20120177541
申请日期
2012.07.23
申请人
RAYTHEON COMPANY
发明人
HAUHE, MARK S.;CISCO, TERRY C.;MILNE, JASON G.;GOULD, GEORGE;NAHASS, PAUL;ZAFIROPOULOUS, NICK