| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate the deformation of which can be suppressed even during the cooling after mounting an electronic component, and the like, by a reflow furnace.SOLUTION: On the outer periphery of an injection molded substrate 1, a reinforcing portion 11 is provided to surround the perimeter. The reinforcing portion 11 and the injection molded substrate 1 body are coupled by a coupling portion 7. In other words, the reinforcing portion 11 and the injection molded substrate 1 body are molded integrally. The coupling portion 7 is provided with a constriction 9. A reinforcement frame 13 is insert molded to the reinforcing portion 11, as required. A printed circuit board 3 is mounted on a printed circuit board installation part 15, and electronic components 5a, 5b are mounted on electronic component installation parts 17a, 17b. The printed circuit board 3 and electronic components 5a, 5b can be mounted collectively by a reflow furnace. After completing reflow mounting of electronic components, and the like, the reinforcing portion 11 is removed. The reinforcing portion 11 is removed by cutting the coupling portion 7 with a cutting blade. |
