发明名称 めっき液の再生方法、めっき方法、及びめっき装置
摘要 A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method. A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.
申请公布号 JP6033234(B2) 申请公布日期 2016.11.30
申请号 JP20130547171 申请日期 2012.11.27
申请人 不二商事株式会社 发明人 坂野 竜也;後藤 勝博;金澤 統広
分类号 C23C18/16;C23C18/31;C23C18/38;C25D21/14;C25D21/18 主分类号 C23C18/16
代理机构 代理人
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