| 摘要 |
There is disclosed a phenol resin foam which contains a phenol resin, and a foaming agent comprising at least either one of a chlorinated hydrofluoroolefin or a non-chlorinated hydrofluoroolefin. With respect to the phenol resin foam, a density is 10 kg/m 3 or more and 150 kg/m 3 or less, a thermal conductivity under a 10°C environment is 0.0175 W/m·k or less, and a thermal conductivity under a 23 °C environment is 0.0185 W/m·k or less. |
