发明名称 フェノール化合物、エポキシ樹脂、エポキシ樹脂組成物、プリプレグおよびそれらの硬化物
摘要 A phenolic compound which can be obtained by reacting the compound of the formula (1): wherein R1 groups are each independently present and represent a hydrogen atom etc. with the formula (6): wherein R4 groups are each independently present and represent a hydrogen atom etc.; and k represents the number of R4 groups and is an integer of 0 to 4 and an epoxy resin which can be obtained by reacting the phenolic compound with an epihalohydrin are excellent in solvent solubility and also of which cured product has an excellent thermal conductance.
申请公布号 JP6033919(B2) 申请公布日期 2016.11.30
申请号 JP20150112028 申请日期 2015.06.02
申请人 日本化薬株式会社 发明人 川井 宏一;押見 克彦;須永 高男;井上 一真
分类号 C08G59/20;C08J5/24;H01B3/40 主分类号 C08G59/20
代理机构 代理人
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