| 摘要 |
The present invention is adhesive material for a wafer processing used for temporarily bonding a supporting substrate to a wafer having a front surface includes a circuit formed thereon and a back surface to be processed, including a first temporary adhesive layer composed of a layer (A) of a silicone-modified styrene base thermoplastic elastomer, and a second temporary adhesive layer composed of a thermosetting polymer layer (B) laminated on the first temporary adhesive layer, wherein the layer (A) is capable of releasably adhering to the front surface of the wafer, and the layer (B) is capable of releasably adhering to the supporting substrate. Thereby, there can be provided a temporary adhesive material for a wafer processing, a wafer processing lamination, and a method for manufacturing a thin wafer using the same, which facilitates temporary adhesion between a supporting substrate and a wafer having a circuit, is highly compatible with steps of forming a TSV and forming a wiring on the back surface of the wafer, allows easy delamination, and is capable of increasing productivity of thin wafers, |
