发明名称 半導体検査装置、及び荷電粒子線を用いた検査方法
摘要 Provided are an inspection device that detects with high precision and classifies surface unevenness, step batching, penetrating blade-shaped dislocations, penetrating spiral dislocations, basal plane dislocations, and stacking defects formed in an SiC substrate and an epitaxial layer; and a system. In the inspection device using charged particle beams, a device is used that has an electrode provided between a sample and an objective lens, said device being capable of applying a positive or negative voltage to the electrode and obtaining images. A secondary electron emission rate is measured and energy EL and EH for the charged particles are found. First, an image (first image) is obtained using the EH and positive potential conditions. Next, an image (second image) is obtained using the EL and negative potential conditions. Next, an image (third image) is obtained at the same position as the second image, and by using the EL and positive potential conditions.
申请公布号 JP6033325(B2) 申请公布日期 2016.11.30
申请号 JP20140546818 申请日期 2012.11.19
申请人 株式会社日立製作所 发明人 木村 嘉伸;津野 夏規;太田 洋也;山田 廉一;大野 俊之;毛利 友紀
分类号 H01L21/66;H01J37/22;H01J37/28 主分类号 H01L21/66
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