发明名称 |
SUCKING/HOLDING JIG, SUCKING/HOLDING DEVICE EQUIPPED WITH THIS JIG, SUCKING/HOLDING METHOD, PROCESSING METHOD OF SUBSTRATE, AND FILM FORMATION METHOD OF SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a sucking/holding jig for stably applying a film formation processing to a wide area of a substrate surface while preventing sneaking of a film formation material.SOLUTION: A sucking/holding jig 10 includes: an attachment face 14 attachable to only a peripheral edge part of a substrate; and a slot 16 for absorption which is opened to the attachment face. An area where an insufficient attracting force occurs in the peripheral edge part of the substrate is eliminated as much as possible by absorbing the peripheral edge part of the substrate over the whole periphery without omission as much as possible. Creeping to the rear face of a film forming material is prevented by avoiding floating up of the peripheral edge part, and film formation processing is correctly applied to only the surface on the side which becomes a film formation subject.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016197623(A) |
申请公布日期 |
2016.11.24 |
申请号 |
JP20150075847 |
申请日期 |
2015.04.02 |
申请人 |
NIPPON ELECTRIC GLASS CO LTD |
发明人 |
TANABE YASUTAKA;FUKUI ETSUJI;KAJIOKA TOSHIYUKI |
分类号 |
H01L21/683;C23C14/50 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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