| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a mounting substrate with a land having a first surface and a second surface higher than the first surface, a side-emission type light emitting device including an external connecting terminal disposed on the first surface, and a bonding member disposed at least on the second surface to bond the external connecting terminal and the land. |
| 申请公布号 |
US2016343915(A1) |
申请公布日期 |
2016.11.24 |
| 申请号 |
US201615158139 |
申请日期 |
2016.05.18 |
| 申请人 |
NICHIA CORPORATION |
发明人 |
WAKAKI Ryosuke |
| 分类号 |
H01L33/48;H01L33/24;H01L33/62 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a mounting substrate with a land having a first surface and a second surface higher than the first surface; a side-emission type light emitting device including an external connecting terminal disposed on the first surface; and a bonding member disposed at least on the second surface to bond the external connecting terminal and the land. |
| 地址 |
Anan-shi JP |
