SEMICONDUCTOR DEVICE

摘要

An object of the present invention is to improve the reliability of a semiconductor device having an imaging function.;A semiconductor device includes a package having a cavity and terminals (TE1), a semiconductor chip that has an imaging unit and is arranged in the cavity, and a cap material with which the cavity is sealed and which has translucency. In addition, the semiconductor device includes a mounting board that has a through-hole and terminals (TE2) and is arranged so as to electrically couple the terminals (TE1) to the terminals (TE2), a heat transfer member that is inserted into the through-hole and is coupled to the package, and a heat sink coupled to the heat transfer member.

主权项

1. A semiconductor device comprising:
an insulating base material that has a first upper surface and a first lower surface positioned on the opposite side of the first upper surface, a cavity on the first upper surface side, and first terminals on the first lower surface; a semiconductor chip that has a first top surface and a first back surface positioned on the opposite side of the first top surface, and an imaging unit on the first top surface side, and is arranged in the cavity; a cap member that seals the cavity and has translucency; a mounting board that has a second upper surface and a second lower surface positioned on the opposite side of the second upper surface, a through-hole, and second terminals on the second upper surface, and is arranged in such a manner that the first terminals and the second terminals are electrically coupled to each other while allowing the first lower surface of the insulating base material to face the second upper surface; a heat transfer member that is inserted into the through-hole, and is coupled to the insulating base material, and a heat radiation member that is arranged on the second lower surface side of the mounting board, and is coupled to the heat transfer member.