发明名称 SURFACE ACOUSTIC WAVE DEVICE, HIGH FREQUENCY MODULE AND METHOD FOR MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE
摘要 This surface acoustic wave device is provided with: a piezoelectric substrate (11); an IDT electrode (20) which is provided on one main surface of the piezoelectric substrate (11); a support layer (50) which is formed to stand on the main surface around a region where the IDT electrode (20) is provided, and the height of which from the main surface is higher than that of the IDT electrode (20); a cover layer (60) which is arranged on the support layer (50) and covers the IDT electrode (20); and a columnar electrode (70) which is formed to stand on the main surface, while being in contact with the support layer (50), and which is electrically connected to the IDT electrode (20). This surface acoustic wave device is provided with an internal space that is surrounded by the piezoelectric substrate (11), the support layer (50) and the cover layer (60). The columnar electrode (70) has a bottom surface (73), an upper surface (71) and a lateral surface (72); and the upper surface (71) and the lateral surface (72) respectively have exposure portions that are exposed to the outside.
申请公布号 WO2016185866(A1) 申请公布日期 2016.11.24
申请号 WO2016JP62686 申请日期 2016.04.21
申请人 MURATA MANUFACTURING CO., LTD. 发明人 FUNAHASHI, Kentaro
分类号 H03H9/25;H03H3/08 主分类号 H03H9/25
代理机构 代理人
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