COPPER POWDER, COPPER PASTE USING SAME, CONDUCTIVE COATING MATERIAL, CONDUCTIVE SHEET, AND METHOD FOR PRODUCING COPPER POWDER

摘要

Provided is a copper powder which is capable of being suitably employed for use as a conductive paste, an electromagnetic-wave shield, and the like, while ensuring excellent conductivity by increasing contact points between the copper powder. A copper powder 1 according to the present invention forms a dendritic shape having a trunk 2 which grows linearly, and a plurality of branches 3 which branch off from the trunk 2. Plate-shaped copper particles having an average cross-sectional thickness of 0.02-5.0 µm agglomerate to form the trunk 2 and the branches 3. The average particle size (D50) of the copper powder 1 is 1.0-100 µm. The maximum height of the plate-shaped surfaces of the copper particles in the vertical direction is not more than 1/10 of the maximum length of the plate-shaped surfaces in the horizontal direction.