发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition having high mechanical strength, and to provide a molding formed by molding the polyamide resin composition.SOLUTION: There is provided a polyamide resin composition which contains at least one a polyamide resin, a maleic anhydride-modified polyphenylene ether-based resin, a glass fiber, and a sizing agent and a surface treating agent of the glass fiber, a ratio of isophorone diisocyanate exceeds 20 mass% in a gas component obtained by heating at least one of the sizing agent and the surface treating agent at 280°C for one hour, the polyamide resin is composed of a structural unit derived from a dicarboxylic acid and a structural unit derived from diamine, 50 mol% or more of the structural unit derived from the dicarboxylic acid is a polyamide resin composition derived from aliphatic dicarboxylic acid having 9 to 18 carbon atoms, and an amount of maleic anhydride in the maleic anhydride-modified polyphenylene ether-based resin is 0.01-1.0 mass% in terms of a maleic acid amount.SELECTED DRAWING: None
申请公布号 JP2016196563(A) 申请公布日期 2016.11.24
申请号 JP20150076778 申请日期 2015.04.03
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 OKAMOTO AKITO
分类号 C08L77/06;C08K3/40;C08L71/10 主分类号 C08L77/06
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