WAFER TRANSPORT DEVICE

摘要

A wafer transport device including a robot arm and a C-ring is provided. The C-ring is disposed on the robot aim. The C-ring includes a C-ring body and a staircase structure. The staircase structure is disposed on an inner side of the C-ring body. The staircase structure has a plurality of wafer carrying surfaces, and heights of the wafer carrying surfaces are gradually decreases toward an interior of the C-ring.

主权项

1. A wafer transport device, comprising:
a robot arm; and a C-ring, disposed on the robot arm, and comprising:
a C-ring body; anda staircase structure, disposed on an inner side of the C-ring body, wherein the staircase structure has a plurality of wafer carrying surfaces, and heights of the wafer carrying surfaces are gradually decreases toward an interior of the C-ring.