发明名称 Microchip Composite Structure of Ce:Yag and Production Method
摘要 The present invention relates to a Ce:YAG wafer-based composite structure comprising a Ce:YAG wafer and a red light emitting layer fixed on the Ce:YAG wafer. The present invention also relates to a method for the preparation of the Ce:YAG wafer-based composite structure. The optical composite structure realizes a wide waveband luminescence from green light to red light, and can be widely used in the fields of detection equipment and illumination devices.
申请公布号 US2016341832(A1) 申请公布日期 2016.11.24
申请号 US201514719288 申请日期 2015.05.21
申请人 DM Lighting Technologies Inc. 发明人 Cao Dun-Hua;Dong Yong-Jun;Liang Yue-Shan
分类号 G01T1/202 主分类号 G01T1/202
代理机构 代理人
主权项 1. A Ce:YAG wafer-based composite structure, wherein said composite structure comprises: a Ce:YAG wafer; and a red light emitting layer fixed on said Ce:YAG wafer.
地址 Montclair CA US