发明名称 |
Microchip Composite Structure of Ce:Yag and Production Method |
摘要 |
The present invention relates to a Ce:YAG wafer-based composite structure comprising a Ce:YAG wafer and a red light emitting layer fixed on the Ce:YAG wafer. The present invention also relates to a method for the preparation of the Ce:YAG wafer-based composite structure. The optical composite structure realizes a wide waveband luminescence from green light to red light, and can be widely used in the fields of detection equipment and illumination devices. |
申请公布号 |
US2016341832(A1) |
申请公布日期 |
2016.11.24 |
申请号 |
US201514719288 |
申请日期 |
2015.05.21 |
申请人 |
DM Lighting Technologies Inc. |
发明人 |
Cao Dun-Hua;Dong Yong-Jun;Liang Yue-Shan |
分类号 |
G01T1/202 |
主分类号 |
G01T1/202 |
代理机构 |
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代理人 |
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主权项 |
1. A Ce:YAG wafer-based composite structure, wherein said composite structure comprises:
a Ce:YAG wafer; and a red light emitting layer fixed on said Ce:YAG wafer. |
地址 |
Montclair CA US |