| 发明名称 |
METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS |
| 摘要 |
Methods for reducing wafer bow induced by an anti-reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side. |
| 申请公布号 |
US2016340179(A1) |
申请公布日期 |
2016.11.24 |
| 申请号 |
US201615227181 |
申请日期 |
2016.08.03 |
| 申请人 |
RAYTHEON COMPANY |
发明人 |
Gooch Roland W.;Diep Buu Q.;Black Stephen H.;Kocian Thomas A.;Kennedy Adam M. |
| 分类号 |
B81C1/00;B81B7/00 |
主分类号 |
B81C1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of reducing wafer bow induced by an anti-reflective coating on a cap wafer, the method comprising:
providing the cap wafer having a planar side and an opposing cavity side, the cavity side including at least one recessed region and a dividing region on either side of the at least one recessed region; and depositing a layer of an anti-reflective coating material onto the planar side of the cap wafer to provide a discontinuous coating on the planar side such that the discontinuous coating is dimensioned and configured to partially overlap the dividing region. |
| 地址 |
Waltham MA US |
