| 发明名称 |
PRESSURE SENSOR PACKAGE WITH STRESS ISOLATION FEATURES |
| 摘要 |
A sensor package includes a manifold and a MEMS die. The manifold includes a cylindrical body, a flange, and a mounting surface. The cylindrical body defines a first passage that extends longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body. The flange extends from the cylindrical body and has an outer periphery that is configured to support a print circuit board. The mounting surface is disposed at the interior end of the first passage. The surface area of the mounting surface is less than the surface area of a MEMS die configured to mate with the mounting surface. |
| 申请公布号 |
US2016340176(A1) |
申请公布日期 |
2016.11.24 |
| 申请号 |
US201514716515 |
申请日期 |
2015.05.19 |
| 申请人 |
Rosemount Aerospace Inc. |
发明人 |
Potasek David P.;Stuelke Robert |
| 分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sensor package comprising:
a manifold comprising:
a cylindrical body defining a first passage extending longitudinally along a central axis from a first exterior end to an interior end of the cylindrical body;a flange extending from the cylindrical body along an outer periphery of the cylindrical body; anda mounting surface disposed at the interior end of the first passage; and a MEMS die bonded to the mounting surface, wherein a surface area of the mounting surface is less than a surface area of a MEMS die. |
| 地址 |
Burnsville MN US |
