| 摘要 |
A method and apparatus 100 for plating articles comprises providing a plating solution comprising a liquid medium and plating the articles such that the precursor species forms a metallic layer. A plurality of luminescent particles are suspended in the liquid medium, at least some of which have a diameter of 10 um or less, wherein the luminescent particles have a D50 distribution. The distribution is measured using laser light scattering, in accordance with ASTM U0P856-07, of 10 µm or less. The articles are located within the plating solution, such that the precursor species forms the metallic layer on the articles and the luminescent particles are deposited within the metallic layer while it is formed. The plating is carried out while the articles are within a receptacle that moves during the plating process receptacle and the receptacle rotates at a speed of 1 to 15 rpm. Further disclosed is a method for plating articles, wherein before or during plating the plating solution is subjected to an ultrasound (ultrasonic) treatment and plating is carried out while the articles are within a receptacle that moves continuously 102. |
